- 1 Improving facility safety without increasing footprint
- 2 Same operability with less wiring
- 3 OTHER SOLUTIONS WORTH EXPLORING
Preparatory processes for semiconductor/FPD manufacturing involve several high-temperature procedures. Failure to sufficiently control temperatures during these procedures can lead to serious incidents, but adding equipment to improve safety would increase the facility’s footprint.
Improving facility safety without increasing footprint
Omron’s Value Design for Panel products consume dramatically less space compared to their previous counterparts. In the case of temperature control devices, for example, measures such as side-by-side mounting of power supplies and heater SSRs allow all equipment to fit inside the panel, and even make room for temperature monitoring relays that ensure facility safety, as shown in the figure below.
Same operability with less wiring
Same operability as on-panel models
Horizontal connection structure reduces crossover wiring effort
Compact 22.5 mm-wide DIN track-mounting model with operability common to E5 □ C Temperature Controllers saves panel space.
Up to 16 units can be attached by their connectors for power/communication, reducing wiring effort.
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